2017 Most Popular BGA Reballing IC for Mobile Phone Repairing - VIPPROGRAMMER

Cell phone BGA IC repair is familiar operation for professionals. However, it's not so easy if you are beginner in cell phone repairs. There are a lot of reballing tools you need to prepare, also, you have to practice as much as possible for the reballing process. For reballiing cell phone BGA IC, BGA Kit is specially essential, it is used for reballing the solder balls of a BGA IC. Many BGA Reballing kit and BGA rework station are available all over the world, choosing the proper reballing kit will be the first step for you future cell phone maintenance!

All of Tools included: 

1. BGA Reballing Stencil: There are iPhone all series BGA reballing stencil in the market, it plays very good important role for BGA repair. Most of them are made of high quality steels, some 3D and multi-purpose reballing stencil will offer better performance.

2. PCB Holder: It offers a convenient platform for cell phone BGA repair,  PCB holder is used for fastening cell phone circuit board for removing, cleaning, and more operation.

3. SMD Rework Station / Hot Air Gun: They are solution for removing IC components from cell phone motherboard, and also helpful to solder them on motherboard again. Buy ESD-Safe SMD Rework Station can avoid any damage due to static electricity.

4. Soldering Iron: It is a useful tool for soldering solder wire and electronic components to the PCB. These soldering irons are available in different wattage. ESD-Safe soldering iron will prevent static charge to damage sensitive electronic components on PCB.

5. Solder Paste:  Solder paste is available in both leaded (with lead) and lead-free (with no lead) forms. It is an assistant for circuit board SMT soldering, BGA welding process, etc.

6. Tweezers:  You'd better to choose fine tip tweezer with anti-corrosive,  anti-magnetic features so that it can keep long-lasting life for more efficient repair. 

7. BGA Desoldering Wire: It also essential for cleaning the solder from the bottom of the IC and the PCB where the IC was soldered, it is a very helpful assistant for BGA repair.

How to reball cell phone BGA IC?

1. Desolder and remove the BGA IC from the PCB.

2. Clean the solder from the bottom of the IC and the PCB where the IC was soldered. Use a soldering iron and desoldering wire or wick.

3. Select the right size IC reballing stencil.

4. Place the IC on the stencil, better to buy one with postioning mold so that will be easier to operate.

5. Apply solder paste from the other side of the stencil. Solder paste will stick to the IC through the tiny holes in the stencil.

6. Apply hot air using SMD rework station. This will solidify the solder paste and it will form solder balls that will stick to the IC.

7. Clean the IC with Acetone or IPA solution and remove it from the stencil.

8. Place the IC on the PCB and applying heat to solder BGA back to the PCB. 

This is the whole process for how to reball cell phone BGA IC. Good luck to your cell phone maintenance. More repair skills read at www.vipprogrammer.com.